Quantcast
Channel: AsiaToday Press Releases
Viewing all articles
Browse latest Browse all 10609

Japan's technical strength is being re-evaluated for smartphone use

$
0
0
Dec 04, 2012
Picture: 

Explore the forefront of the Japanese & Asian electronics industry at NEPCON JAPAN.

■ Japan’s technical strength in the electronics industry is being re-evaluated, especially for smartphone use.

iPhone 5 released in last September has been enjoying strong sales, realizing the lightest and thinnest body ever while adding new functions. One of its main attractions is fast data connection using LTE wireless technology, which requires LSI with higher performance. To make it compatible with a lighter and thinner body, microminiature components made in Japan played an important role.

Japan has a huge strength in high-performance electronics components supporting functional advancement of smartphones, such as high-frequency filter, coil, microminiature terminal, electronic compass, crystal oscillator, and so on. It is estimated that 40% of over 1,000 smartphone components are made in Japan, including liquid crystal panel, flash-memory, DRAM, etc.

■ Explore the forefront of Japanese & Asian electronics industry at NEPCON JAPAN 2013, Asia’s largest electronics event

“NEPCON JAPAN - 42nd Electronics R&D and Manufacturing Technology Expo” is the best place to see the latest technical development in the electronics industry, gathering the cutting-edge products/technologies from Japan - the technically-advanced market, and other major players in the current global electronics market – Korea, Taiwan and China. Showcasing all kinds of products/technologies for electronics R&D and manufacturing such as advanced electronic materials, components, devices, packaging/mounting/inspection technologies, micro fabrication technologies, etc., the 2013 show is expected to gather 1,420 exhibitors & 75,000 visitors from all over Asia (Asia’s LARGEST, including concurrent AUTOMOTIVE WORLD 2013).

Responding to the great demand from the industry, special zone “Boards & Components for Smart Phone Zone” is launched this time, where all kinds of products needed for design and R&D of smartphones, tablet PCs and other mobile devices are showcased.
Why not attend NEPCON JAPAN 2013 and explore the forefront of the electronics industry?

>> FREE Invitation Ticket Request

** The full program of the co-held Technical Conference [190 presentations in total]

>>>www.nepconjapan.jp/en/seminar/

Event Outline

Event Title: NEPCON JAPAN 2013 - 42nd Electronics R&D and Manufacturing Technology Expo
www.nepconjapan.jp/en/

Dates : January 16(Wed) - 18(Fri), 2013

Venue : Tokyo Big Sight, Japan

Organised by : Reed Exhibitions Japan Ltd.

Exhibitions inside NEPCON JAPAN 2013

  • 42nd INTERNEPCON JAPAN (Electronics Manufacturing and SMT)
  • 30th ELECTROTEST JAPAN
  • 14th IC Packaging Technology Expo
  • ELE EXPO - 14th Electronic Components Expo
  • PWB EXPO - 14th Printed Wiring Boards Expo
  • MATERIAL JAPAN - 4th Advanced Electronic Material Expo
  • MicroTech JAPAN - 3rd Micro Fabrication/Fine Process Technology Expo

    Concurrent Shows

  • AUTOMOTIVE WORLD 2013 www.automotiveworld.jp/en/
  • LIGHTING JAPAN 2013 www.lightingjapan.jp/en/

    Number of Exhibitors : 1,420 (expected, including AUTOMOTIVE WORLD)

    Number of Visitors : 75,000 (expected, including AUTOMOTIVE WORLD)

    Contact us:
    NEPCON JAPAN Show Management, Reed Exhibitions Japan Ltd.
    Attn: Kyoko Nagakusa (Ms.), International PR
    TEL: +81-3-3349-8518 / Email: inw-pr@reedexpo.co.jp / Website: www.nepconjapan.jp/en/

  • Category: 
    Event
    Trade Show
    FeaturedNews: 
    Show in Featured News

    Viewing all articles
    Browse latest Browse all 10609

    Trending Articles